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tc78h600fng/ftg 2012-09-05 1 cd integrated circuit silicon monolithic tc78h600fng/ftg dual-bridge driver ic for dc motors the tc78h600fng/ftg is a dual-bridge driver ic for dc mo tors which incorporates dmos in output transistors. dmos output driver with low on-resis tance and pwm drive system are applied to realize high efficiency driving. features ? power supply voltage for motor: vm=15v (max) ? power supply voltage for control: vcc=2.7v to 5.5v (operation range) ? output current: iout 0.8a (max) ? output on resistance: ron=1.2 ? (upper and lower sum) ? internal pull-down resistors on inputs: 200 k ? (typ.) ? built-in over current detection (isd), thermal shutdown (tsd) circuit, and under voltage lockout (uvlo) circuit. ? alert output pin ? package: tc78h600fng;ssop20, TC78H600FTG; qfn24 ? built-in cross conduction protection circuit * this product has a mos stru cture and is sensitive to electrostatic discharge. wh en handling this product, ensure that the environm ent is protected against electrostatic discharge by using an earth strap, a conductive mat and an ionizer. ensure also that the ambient temperature and relative humidity are maintained at reasonable levels. *the ic should be installed correctly. otherwise, the ic or peripheral parts and devices may be degraded or permanently damaged. weight: ssop20-p-225-0.65a: 0.09g(typ.) p-wqfn24-0404-0.50-004: 0.03g(typ.) p-wqfn24-0404-0.50-004
tc78h600fng/ftg 2012-09-05 2 block diagram gnd vcc h-bridge a vm ao2 ao1 rsgndb tsd osc in1a in2a pwma pre drive stby h-bridge b bo2 bo1 rsgndb stanby input circuit pre drive osc uvlo vref alert isd in1b in2b pwmb select vref por i s d tsd input circuit h-bridge a h-bridge b rsgnda
tc78h600fng/ftg 2012-09-05 3 pin functions pin no. tc78h 600 fng tc78h 600 ftg pin name functional description remarks 1 4, 5 vcc power supply pin for logic block vcc(opr)=2.7 to 5.5v 2 6 stby standby input refer to ?input/output functions?. 3 7 osc connection pin for an exte rnal capacitor used for internal oscillation 4 8 in2b control input pin for bch (2 ) refer to ?input/output functions?. 5 9 in1b control input pin for bch (1 ) refer to ?input/output functions?. 6 10, 11 vm power supply pin for output vm (opr) = 2.5 to 15.0 v 7 12 pwmb pwm signal input pin for bc h refer to ?input/output functions?. 8 13 bo2 output pin of b phase (2) connect bo2 to a motor coil pin. 9 14 rsgndb connection pin for a b-phase output current detection resistor refer to ?select direct pwm or constant current pwm?. 10 15 bo1 output pin of b phase (1) connect bo1 to a motor coil pin. 11 16 ao2 output pin of a phase (2) connect ao2 to a motor coil pin. 12 17 rsgnda connection pin for an a-phase output current detection resistor refer to ?select direct pwm or constant current pwm?. 13 18 ao1 output pin of a phase (1) connect ao1 to a motor coil pin. 14 19 select constant pwm, direct pwm select pin 15 20, 21 gnd ground pin 16 22 alert monitor signal pin for tsd and isd (output ) open drain, pulled up by an external resistor 17 23 pwma pwm signal input pin for ac h refer to ?input/output functions?. 18 1 vref external set terminal for a-phase and b-phase reference voltage refer to ?select direct pwm or constant current pwm?. 19 2 in2a control input pin for ach (2 ) refer to ?input/output functions?. 20 3 in1a control input pin for ach (1 ) refer to ?input/output functions?. TC78H600FTG: pin no. 24 of qfn24: n.c. input pin (in1a, in1b, in1b, in2b, pwma, pwmb, selsct, and stby) output pin (alert) vcc 200k ? 100 ?
tc78h600fng/ftg 2012-09-05 4 pin assignment (top view) tc78h600fng ssop20 TC78H600FTG p-wqfn24 rsgndb rsgnda rsgndb rsgnd a
tc78h600fng/ftg 2012-09-05 5 absolute maximum ratings (ta =25c) characteristics symbol rating unit vcc 6 v power supply voltage vm 18 v peak, iout(ao), iout(bo), per one phase, tw 10ms, duty 20% 1.0 a continuously, iout(ao), iout(bo), per one phase 0.8 a output current i alert 4 ma output voltage of alert v alert 6 v input voltage v in -0.2 to vcc+0.2 v 0.71 (note 1) tc78h600fng 0.96 (note 2) power dissipation p d TC78H600FTG 3.17(note 3) w operation temperature t opr -20 to 85 c storage temperature t stg -55 to 150 c note 1: ic only note 2: when mounted on a glass epoxy board (50 mm 50 mm 1.6 mm, cu area: 40 %) note 3: mounted on the board (76 mm 114 mm 1.6 mm, 4 layers in accordance with the relevant jesd-51) the absolute maximum ratings of a semiconductor device are a set of specified parameter values that must not be exceeded during operation, even for an instant. if any of these ratings are exceeded during operation, the electrical characterist ics of the device may be irreparably altered, in which case the reliability and lif etime of the device can no longer be guaranteed. moreover, any exceeding of the ratings during operation may cause breakdown, damage and/or degradation in other equipment. applications using the device should be design ed so that no absolute maximum rating will ever be exceeded under any operating condition. operating range (ta = -20 to 85c) characteristics symbol condi tions min typ. max unit controlled power supply voltage vcc (opr) D 2.7 3.3 5.5 v motor power supply voltage vm (opr) D 2.5 5 15 v output current i out D D D 0.8 a input voltage v in D D D 5.5 v input voltage vref D 0.4 2.5 vcc 1.8 v pwm frequency (input in direct pwm drive) fpwm duty50% in1a, in2a, pwma, in1b, in2b, pwmb 1 D 500 khz oscillation frequency fosc cosc=220pf 160 320 480 khz chopping frequency fchop in constant current pmw mode 180pf cosc 260pf 20 40 60 khz maximum current is limited by power dissipation. it depend s on the ambient temperature, excitation mode, and heat radiation of the board.
tc78h600fng/ftg 2012-09-05 6 electrical characteristics (ta=25c, vcc=3.3v, vm=5v, r nf =2 ?, c osc =220pf, unless otherwise specified.) characteristics symbol test condition min typ. max unit v in (h) 2 D 5.5 v input voltage (note) v in (l) select, pwma, pwmb, in1a, in1b, in2a, in2b, reset, stby -0.2 D 0.8 v hysteresis voltage v hys select, pwma, pwmb, in1a, in1b, in2a, in2b, reset, stby D 200 D mv i inh v in = 3.3v 11 16.5 22 a input current i inl v in = gnd 2 4 8 a i cc1 stop mode D 4 6 ma i cc2 forward/reverse mode D 4 6 ma i cc3 standby mode D 5 10 a i m1 stop mode D 1 2 ma i m2 forward/reverse mode D 0.5 1 ma consumption current i m3 standby mode D D 1 a lower threshold uvld design target value D 2.2 D v undervoltage lockout threshold at v cc upper threshold uvlc design target value D 2.3 D v lower threshold uvld design target value D 2.0 D v undervoltage lockout threshold at vm upper threshold uvlc design target value D 2.1 D v alert output voltage v alert i alert =1ma D D 0.5 v tsd operating temperature (note) tsd design target value D 170 D c tsd recovery temperature (note) tsdhys design target value D 40 D c osc frequency f osc c osc = 220 pf 210 320 430 khz (note) as for the design target value, toshi ba does not implement testing before shipping.
tc78h600fng/ftg 2012-09-05 7 output block characteristics symbol test condition min typ. max unit i out = 0.2 a D 0.24 0.32 output saturation voltage v sat (u+l) i out = 0.6 a D 0.72 0.96 v v f u D 1 1.2 diode forward voltage v f l i out = 0.6 a D 1 1.2 v t r D 20 D t f design target value output load 25 ? + 15 pf D 20 D t plh(pwm) D 500 D output transistor switching characteristics t phl(pwm) design target value D 500 D ns upper i oh D D 1 output leakage current lower i ol vm = 15v D D 1 a p d ? ta characteristics ic g j-a = 176c/w g?r pcb e 50 mm 50 mm 1.6 mm cu e > = 40% g?r pcb e 76.2 mm 114.3 mm 1.6 mm ambient temperature ta (c) power dissipation p d (w) p d ? tc78h600fng pd - ta 0.00 0.50 1.00 1.50 0 50 100 150 (w) (1) (2) (1) ic gj-a=176 c /w (2) g?r pcb e 50501.6mm cu e 40% (3) g?r pcb e 76.2114.31.6mm cu e 30% (3) (1) ic only j-a = 176c/w (2) when mounted on the board, pcb area 50 mm 50 mm 1.6 mm cu area 40% (3) when mounted on the board, pcb area 76.2 mm 114.3 mm 1.6 mm cu area 30% ? TC78H600FTG ambient temperature ta (c) power dissipation p d (w) pd - ta 0.00 0.50 1.00 1.50 2.00 2.50 3.00 3.50 4.00 0 25 50 75 100 125 150 175 (w) when mounted on the board, pcb area 76mm114mm1.6mm 4 layers (in accordance with jesd-51)
tc78h600fng/ftg 2012-09-05 8 input/output functions select=l (direct pwm mode) input output stby in1 in2 pwm o1 o2 mode h h h h l l l short brake h l h forward/reverse h l h l l l short brake h h l reverse/forward h h l l l l short brake h h l l l off (high impedance) stop h l l off (high impedance) standby select=h (constant current pwm mode) input output stby in1 in2 pwm o1 o2 mode h h h h l l l short brake h l h constant current pwm, cw (out2 out1) h l h l l l short brake h h l constant current pwm, ccw (out1 out2) h h l l l l short brake h h l l l off (high impedance) stop h l l off (high impedance) standby select direct pwm or constant current pwm (1) constant current pwm connect the current detection resist or (rnf) to rsgnda and rsgndb. configuration of output current is as follows; iout (a) = (1/5 vref (v)) rnf ( ? ) the setting range of vref: 0.4v to 3.4v, (vcc 1.8) v or less. the voltage of less than 0.4v decreases operation accuracy. use the ic by connecting the resistance (rnf) of 0.3 ? or more. (2) direct pwm connect rsgnda, rsgndb, and vref to gnd pin.
tc78h600fng/ftg 2012-09-05 9 stand by mode all functions are turned off to reduce the power consumption. osc 1. triangle wave is generated internally by connecting the external capacitor to osc terminal and cr oscillates. 2. 180 pf cosc 260pf (oscillation image) osc waveform osc internal waveform
tc78h600fng/ftg 2012-09-05 10 test waveform ? switching characteristics of output transistor relation of pwm input and switching characteri stics of output transistor is shown below. symbol t y p i c a l v a l u e unit t plh 500 t phl 500 t r 20 t f 20 ns output voltage (ao1, ao2, bo1, bo2) 90% 10% 50% t plh t r 50% t phl 90% 10% t f pwm input (pwma, pwmb)
tc78h600fng/ftg 2012-09-05 11 alert (output pin) tsd or either isd operates: alert = low alert pin should be connected to the power su pply externally through the pull-up resistor. v alert = 0.5v (max.) at 1ma tsd isd alert pin detecting detecting no detecting detecting detecting no detecting low no detecting no detecting z open drain connection 5 v
tc78h600fng/ftg 2012-09-05 12 pwm control function applying a pwm signal to the pwm pin allows motor speed control. (pwm drive can be operated by inputting pwm signal to in1 and in2 pins without using pwm pin.) the ic enters cw (ccw) mode and short brake mode alternately in pwm current control. to prevent shoot-through cu rrent caused by simultaneous conduction of upper and lower transistors in the output stage, a dead time is internally generate d when switching the uppe r and lower transistors. therefore, synchronous rectif ication for high efficiency in pwm curre nt control can be achieved without an off-time that is generated via an external input. even when toggling between each mode (cw, ccw, and short brake), the o ff-time is not required due to the internally generated dead time. design target value: dead time, pwm on off: t2=300ns pwm off on: t4=300ns pwm on t5 vcc m gnd out1 vcc m gnd pwm off t3 out1 vcc m gnd pwm on t1 out1 vcc m gnd pwm on off t2 = 300 ns (typ.) out1 vcc m gnd pwm off on t4 = 300 ns (typ.) out1 rsgnd vcc waveform of output voltage (ao1) t1 t2 t3 t5 t4
tc78h600fng/ftg 2012-09-05 13 constant current pwm control the operation moves to constant current pwm control mode when select pin outputs high. this circuit operates with peak current detection method. the current outputs constantly by inputting constant voltage from vref pin. frequency is fixed. it is fixed to 12.5% fast decay mode. charge-discharge frequency of the pwm drive corresponds to 8 cycles of os c. only the length of the last cy cle of osc is decayed by the fast mode. zero cross point is detected. *nf: the point that output current reaches configuration current. in below figure, mdt means the poin t of mdt (mixed decay timming). nf osc internal waveform f chop 12.5% fast decay mode configuration current mdt charge mode nf: reaching configuration current slow mode mixed decay timming fast mode monitoring current (in case configuration current > output current) charge mode
tc78h600fng/ftg 2012-09-05 14 constant current pwm control mode: current waveform when configuration current changes by changing vref ? nf point comes after mixed decay timming ? mixed decay mode: output current > configuration current though i out is higher than the configurat ion current, charging current flows instantly for confirming the current. nf nf osc internal waveform i out f chop f chop configuration current configuration current 12.5% fast decay mode point of mdt (mixed decay timming) nf nf i out configuration current configuration current 12.5% fast decay mode f chop f chop charge ? fast point of mdt (mixed decay timming) nf nf i out configuration current 12.5% fast decay mode point of mdt (mixed decay timming) f chop f chop f chop configuration current
tc78h600fng/ftg 2012-09-05 15 thermal shut down (tsd) circuit the tc78h600fng/ftg includes a thermal shutdown circui t, which turns the output transistors off when the junction temperature (t j ) exceeds 170c (typ.). the output transistors are auto matically turned on when t j cools past the shutdown th reshold, which is lowered by a hysteresis of 40c. tsd = 170c (design target value) (note.) tsd = 40c (design target value) (note.) note. toshiba does not implement testing before shipping. *in thermal shutdown mode, the internal circuitry and outputs assume the same states as in stop mode (in1=in2=l). isd (over current protection) when any of current which flows in 8 dm os transistors exceeds 1.7 a (typ.), all outputs are turned off. it does not resume automatically but latches. it resumes when uvlo operates. however, masking term of 4 s (typ.) should be added in order to avoid detection error by the noise. isd = 1.7a 0.5a (note) note. toshiba does not implement testing before shipping. dmos power transistor current 1.7a (typ.) dead band: 4 s(typ.) (latch state)
tc78h600fng/ftg 2012-09-05 16 under voltage lockout (uvlo) circuit the tc78h600fng/ftg includes an undervoltage lockout circuit, which puts the ou tput transistors in the high-impedance state when v cc decreases to 2.2 v (typ.) or lower. the output transistors are auto matically turned on when v cc increases past the lockout threshold, which is raised to 2.3 v (typ.) by a hysteresis of 0.1 v (typ.). the tc78h600fng/ftg includes an undervoltage lockout circuit, which puts the ou tput transistors in the high-impedance state when vm decreases to 2.0 v (typ.) or lower. the output transistors are auto matically turned on when vm increases past the lockout threshold, which is raised to 2.1 v (typ.) by a hysteresis of 0.1 v (typ.). state of the internal ic and output state when uvlo function operates ar e same as that of the stop mode (in1=in2=l).
tc78h600fng/ftg 2012-09-05 17 application circuit (1) direct pwm vcc alert select stby in1a in2a osc vref gnd vm ao1 ao2 bo2 bo1 rsgnda rsgndb cpu i/o tc78h600fng/ftg v m 5v + - 220pf 0.1f 33f vcc=3.3v + - 0.1f 10f pwma in1b in2b pwmb dc? ` dc? ` dc brush motor dc brush motor vm=5v
tc78h600fng/ftg 2012-09-05 18 (2) constant current pwm note 1: a power supply capacitor should be connected as close as possible to the ic. note 2: when the power is turned on and off, set in1 and in2 for low. if in1 and in2 are set high in turning on and off the power, unexpected current may be flown in the output pin depending on the situation. caution for using utmost care is necessary in the design of the output, v cc , and gnd lines since the ic may be destroyed by short-circuiting between outputs, air contamination faults, or faults due to improper grounding, or by short-circuiting between contiguous pins. especially, power supply pins (vcc, vm) and output pins (ao1, ao2, bo1, and bo2) might destroy the ic and the peripheral parts, cause smoke and ignition, and also do injury when they short-circuit an adjacent pin and other pins. the ic may be destroyed when mounted in the wrong orient ation. thus, please mount it with great care. please use the power supply fuse. vcc alert select stby in1a in2a osc vref gnd vm ao1 ao2 bo2 bo1 rsgnda rsgndb cpu i/o tc78h600fng/ftg v m 5v + - 220pf 1 1 0.1f 33f vcc=3.3v + - 0.1f 10f pwma in1b in2b pwmb dc? ` dc? ` rnf rnf dc brush motor dc brush motor vm=5v
tc78h600fng/ftg 2012-09-05 19 package dimensions weight: 0.09g (typ.)
tc78h600fng/ftg 2012-09-05 20 p-wqfn24-0404-0.50-004 unit: mm weight: 0.03g (typ.)
tc78h600fng/ftg 2012-09-05 21 notes on contents 1. block diagrams some of the functional blocks, circui ts, or constants in the block diagram may be omitted or simplified for explanatory purposes. 2. equivalent circuits the equivalent circuit diagrams may be simplified or some parts of th em may be omitted for explanatory purposes. 3. timing charts timing charts may be simplified for explanatory purposes. 4. application circuits the application circuits shown in this document are provided for reference purposes only. thorough evaluation is required, especially at the mass production design stage. toshiba does not grant any license to any industrial prop erty rights by providing th ese examples of application circuits. 5. test circuits components in the test circuits are us ed only to obtain and confirm the devi ce characteristics. these components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment. ic usage considerations notes on handling of ics [1] the absolute maximum ratings of a semiconductor device are a set of ratings that mu st not be exceeded, even for a moment. do not exceed any of these ratings. exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. [2] use an appropriate power supply fuse to ensure that a la rge current does not continuous ly flow in case of over current and/or ic failure. the ic will fully break down when used under co nditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pu lse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. to minimize the effects of the flow of a large current in case of breakdown, appropri ate settings, such as fuse capacity, fusing time and insertion circuit location, are required. [3] if your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdow n caused by the current resulting from the inrush current at power on or the negative current resulting fr om the back electromotive force at power off. ic breakdown may cause injury, smoke or ignition. use a stable power supply with ics with built-in protection fu nctions. if the power supply is unstable, the protection function may not operate, causing ic breakdow n. ic breakdown may cause in jury, smoke or ignition. [4] do not insert devices in the wrong orientation or incorrectly. make sure that the positive and negative term inals of power supplies are connected properly. otherwise, the current or power co nsumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakd own, damage or deterioration, and may result injury by explosion or combustion. in addition, do not use any device that is applied th e current with inserting in the wrong orientation or incorrectly even just one time.
tc78h600fng/ftg 2012-09-05 22 points to remember on handling of ics (1) over current protection circuit over current protection circuits (referred to as current limiter circuits) do not nece ssarily protect ics under all circumstances. if the over current prot ection circuits operate against the over current, clear the over current status immediately. depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the over current protection circuit to not operate properly or ic breakd own before operation. in addition, depending on the method of use and usage conditions, if over current continues to fl ow for a long time after operation, the ic may generate heat resulting in breakdown. (2) thermal shutdown circuit thermal shutdown circuits do not necessarily protect ics under all circumstances. if the thermal shutdown circuits operate against the over temperature, clear the heat generation status immediately. depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the thermal shutdown circuit to not operate pr operly or ic breakdown before operation. (3) heat radiation design in using an ic with large current flow such as power amp, regulator or driver; please design the device so that heat is appropriately radiated, not to exceed the specified j unction temperature (t j ) at any time and condition. these ics generate heat even during normal use. an in adequate ic heat radiation design can lead to decrease in ic life, deterioration of ic characte ristics or ic breakdown. in addition, please design the device taking into considerate the effect of ic heat ra diation with peripheral components. (4) back-emf when a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor?s power supply due to the effect of back- emf. if the current sink capability of the power supply is small, the device?s motor power supply and output pins might be ex posed to conditions beyond absolute maximum ratings. to avoid this problem, take the effect of back-emf into consideration in system design.
tc78h600fng/ftg 2012-09-05 23 restrictions on product use ? toshiba corporation, and its subsidiaries and affiliates (collect ively "toshiba"), reserve the right to make changes to the in formation in this document, and related hardware, software and systems (collectively "product") without notice. ? this document and any information herein may not be reproduc ed without prior written permission from toshiba. even with toshiba's written permission, reproduc tion is permissible only if reproduction is without alteration/omission. ? though toshiba works continually to improve product's quality and reliability, product can malfunction or fail. customers are responsible for complying with safety standards and for prov iding adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a ma lfunction or failure of product could cause loss of human life, b odily injury or damage to property, including data loss or corruption. before customers use the product, create designs including the product, or incorporate the product into their own applications, cu stomers must also refer to and comply with (a) the latest versions of all relevant toshiba information, including without limitation, this document, the specifications, the data sheets and application notes for product and the precautions and condi tions set forth in the "toshiba semiconductor reliability handbook" and (b) the instructions for the application with which the product will be us ed with or for. customers are solely responsible for all aspe cts of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this product in such design or applications; (b) eval uating and determining the applicability of any info rmation contained in this document, or in c harts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operatin g parameters for such designs and applications. toshiba assumes no liability for customers' product design or applications. ? product is neither intended nor warranted fo r use in equipments or systems that require extraordinarily high levels of quality and/or reliability, and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage and/or serious public impact ( " unintended use " ). except for specific appl ications as expressly stated in this document, unintended use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used f or automobiles, trains, ships and other transportation, traffic si gnaling equipment, equipment used to control combustions or expl osions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. if you use product for unintended use, toshiba assumes no liability for product. for details, please contact your toshiba sales representative. ? do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy product, whether in whole or in part. ? product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. ? the information contained herein is pres ented only as guidance for product use. no re sponsibility is assumed by toshiba for an y infringement of patents or any other intellectual property rights of third parties that may result from the use of product. no license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. ? absent a written signed agreement, except as provid ed in the relevant terms and conditions of sale for product, and to the maximum extent allowable by law, toshiba (1) assumes no liability whatsoever, including without limitation, indirect, co nse quential, special, or incidental damages or loss, including without limitation, loss of profit s, loss of opportunities, business interruption and loss of data, and (2) disclaims any and all express or implied warranties and conditions related to sale, use of product, or information, including warranties or conditions of merchantability, fitness for a particular purpose, accuracy of information, or noninfringement. ? do not use or otherwise make available product or related so ftware or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or m anufacturing of nuclear, chemical , or biological weapons or missi le technology products (mass destruction w eapons). product and related software and technology may be controlled under the applicable export laws and regulations including, without limitat ion, the japanese foreign exchange and foreign trade law and t he u.s. export administration regulations. export and re-export of pr oduct or related software or technology are strictly prohibit ed except in compliance with all appl icable export laws and regulations. ? please contact your toshiba sales representative for details as to environmental matters such as the rohs compatibility of pro duct. please use product in compliance with all applicable laws and regula tions that regulate the inclusion or use of controlled subs tances, including without limitation, the eu rohs directive. toshiba assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations.

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